Book Description
If you have a need to design next-generation products using smaller packages, it needs to be as dense as possible, may or may not have high frequency circuits on it, and you are not sure if your design rules and process are going to work then this book is for you.

This new publication investigates these issues by starting with component tolerances down to 0201's, Micro SMD, CSP, SOIC's, QFP's and etc. Then it looks at studies performed on process and assembly limits, combines it with research on current high volume products to learn things very few in the industry know such as the limits of combing new small packages with SMT, development of very-high density design guidelines never published anywhere permitting spacing as close as .006", and identifies where and how process limitations occur and the possible solutions to overcome these obstacles.

For manufacturing it is vital to know where the limits and problems areas are going to come from when you attempt to implement designs using small packages and or mixing small packages with SMT. There are very serious problems that are quantified in this book with solutions and ideas on how you can avoid those significant yield losses that those not in the know are having happen to them.

Who will Benefit
This book will be of immense value to design and manufacturing engineers as well as CAD designers, and those involved in product testing, fabrication, and troubleshooting.

Table of Contents

Author

Price: $199.00
Author: James C. Blankenhorn
Printed: October, 2001
Pages: Full color, 124 pages 8.5" x 11"
ISBN#: 1-882812-39-5