Book Description
The effectiveness of production manufacturing personnel is key to our success. Until now, there has not been a publication written for use in training the production personnel that we hire to assemble SMT products. It is the first book to break down technical terms so they can be understood by non-technical personnel. This publication, written by two of the industry's leading experts, does an excellent job informing them about what is required to do SMT and proves to be a valuable reference book. It has proven to improve efficiency and contribution.

Building SMT products is significantly different from leaded technology products. Included is information in straight forward terms on SMT components, process changes, steps in handling and building SMT and mixed SMT/leaded assemblies. The standards that we use are explained, plus information on inspection, techniques, soldering and fixing the assemblies.

Training personnel? This is the publication for you!

Table of Contents

1- THE BEGINNINGS of SMT

• The Meaning of SMT
  
• What's Changed from PTH
  
• The Evolution of SMT
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• SMT Components
  
• Printed Circuit Boards
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• Impact of SMT on Manufacturing
  
• Standards That Change
  
• Skills We Need and Why
  
• Why Invest Our Energy-What Impact Can You Have
• 
  

• Types of Solder
  
• Comparing PTH Soldering to SMT Soldering
  
• Fillets and Workmanship Standards for SMT
  
• How to Use Flux & Solder for SMT
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• Repair & Rework Equipment Changes from PTH
  
• Process Flows for Surface Mount Assemblies
  
• Assembling Boards with Only SMT Component
  
• Assembling Boards with SMT & PTH Components
  
• Assembling PTH Boards with SMT on Bottom Only
  
• Assembly Designations
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• Important Parameters of Paste Printing
  
• Placing SMT Parts by Machine
  
• Placing SMT Parts by Hand
  
• Cleaning the Boards
  
• Putting in Through Hole Parts After SMT
  
• Handling the Boards
  
• Staging Boards
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• Looking at the SMT Assemblies
  
• Looking at the SMT Fillets
  
• What's a Good Solder Joint
  
• What Causes Defects
  
• Tagging the Defects & Recording
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• Selecting the Proper Tools
  
• Doing Engineering Changes
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