Table of Contents
Table of Contents
1- INTRO to SMT
- Advantages
- Disadvantages
- Package Types
- Lead Types
- Types of Assembly Lines
- SMT Assembly Equipment.
- Rework
- Test
- Design Requirements
- Classifications
- Sequences of Assembly
- Introduction
- Lead Styles
- Objectives of Land Patterns
- Pattern to Component Basic Guidelines
- Land Patterns for Chip Components
- Land Patterns for Gull-Wing Leads
- Land Patterns for J-Leads
- Land Patterns for MELFs
- Land Patterns for SOTs
- LCC Land Patterns
- Land Patterns for Butt Mounting
- Land Patterns for Power Transistors
- Land Patterns for Tantalums
- Universal Land Patterns
- Placement
- Planes
- Routing
- Silkscreen
- Substrates
- Solder masks
- Tooling Holes
- Setup
- CAD Selection
- Grids
- Routing
- Changes
- Drawings
- Up Front Decisions
- Steps to Implement SMT
- Component Layout
- Area Analysis







