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Table of Contents
| Chapter 1 | 9 |
| Pb-free Initiatives and Global Trends | |
1.1 What is the Industry Size? |
10 |
1.2 What is the Industry Breadth? |
10 |
1.3 What you do is important |
10 |
1.4 Where is the Market? |
11 |
1.5 How about Electronics and the Environment? |
11 |
1.6 A Major Change? |
11 |
1.7 What is the WEEE Directive? |
12 |
1.8 List the Categories of Electronics Included |
12 |
1.9 What is the RoHS Directive? |
13 |
1.10 List the Categories of Electronics Included |
13 |
1.11 What are the RoHS Exemptions? |
14 |
1.12 So what does this mean? |
14 |
1.13 What are some of the Logistical Concerns? |
14 |
1.14 What are the steps you can take? |
15 |
1.15 What about China RoHS? |
15 |
1.16 What about USA RoHS? |
15 |
1.17 What are Japanese "Green" Products? |
16 |
1.18 Why is Pb-free is only a piece of RoHS Compliance |
16 |
| Chapter 2 | 17 |
| Pb-free Alloy Selection | |
2.1 Solder as it is Today
|
18 |
2.2 List the Desirable Pb-free Characteristics
|
18 |
2.3 List the Pb-free Paste Options
|
18 |
2.4 What is the impact on Paste Costs?
|
19 |
2.5 What are Drop-in Solutions?
|
19 |
2.6 List some of the Pb-free Paste Options
|
20 |
2.7 What is the problem with 91Sn9Zn?
|
20 |
2.8 What is the problem with 96.5Sn3.5Ag?
|
21 |
2.9 How about SAC Alloys?
|
21 |
2.10 How about SnAgCuSb?
|
22 |
2.11 How about 58Sn42Bi?
|
22 |
2.12 How about SnAgBi?
|
22 |
2.13 What are the SnAgBi Concerns?
|
22 |
2.14 What looks like the Industry Choice?
|
24 |
2.15 What are the SAC Concerns?
|
25 |
2.16 What are the Things to Remember?
|
26 |
| Chapter 3 | 27 |
| Is Pb-free a Good Thing? | |
3.1 What are the Environmental Implications?
|
28 |
3.2 List the Sources of Environmental Lead
|
28 |
3.3 Why Target Pb in WEEE?
|
28 |
3.4 What about Pb-Free Solder Alloys?
|
29 |
3.5 What is The Decision?
|
29 |
3.6 Is Pb-Free a good thing?
|
30 |
| Chapter 4 | 31 |
| Pb-free Alloy Reliability | |
4.1 Why worry about reliability?
|
32 |
4.2 What about Thermal Cycling Performance?
|
32 |
4.3 What about Thermal Fatigue for BGAs?
|
33 |
4.4 What about creep?
|
34 |
4.5 What does Isothermal Mechanical Cycling include?
|
35 |
4.6 When is Out of Plane Bending a problem?
|
36 |
4.7 Describe Mechanical Shock?
|
37 |
4.8 Summarization of the technical considerations
|
38 |
| Chapter 5 | 39 |
| Pb-free Components | |
5.1 What do you need to know about Pb-free Components? |
40 |
5.2 What are the Component Finish Options? |
40 |
5.3 What about Sn Whiskers: Growth? 41 |
|
5.4 What about Sn Whiskers: Intermetallic Formation? |
41 |
5.5 What is Copper Diffusion: Increasing Whisker Growth? |
44 |
5.6 What is the Whisker Index? |
44 |
5.7 Explain about Sn Whiskers: CTE Mismatch |
45 |
5.8 What about Sn Whiskers: Other Causes? |
46 |
5.9 What about Sn Whiskers: Mitigation? |
46 |
5.10 What about Reliability of Various Component Finishes? |
46 |
5.11 How to make the switch |
47 |
5.12 How about Forward/Backward Compatibility? |
47 |
5.13 What about Component Suppliers? |
48 |
5.14 What are the Labeling Issues? |
48 |
5.15 What are Other Component Concerns? |
49 |
5.16 List Other Component Concerns |
50 |
5.17 What is the Cost Impact? |
51 |
| Chapter 6 | 53 |
| Pb-free Surface Finish | |
6.1 Why the Surface Finish Requirements? |
54 |
6.2 What is the Industry Choice for Surface Finish? |
54 |
6.3 What about Pb-free HASL? (Hot Air Solder Level) |
55 |
6.4 What about ENIG? (Electroless Nickel Immersion Gold) |
55 |
6.5 What about using OSP? (Organic Solder Preservatives) |
56 |
6.6 What about using IAg? (Immersion Silver) |
56 |
6.7 What about using ISn? (Immersion Tin) |
57 |
6.8 Surface Finish Comparison |
58 |
6.9 Summary of different finishes |
59 |
| Chapter 7 | 61 |
| Failure Modes | |
7.1 What is Conductive Anode Filament Growth (CAF)? |
62 |
7.2 What causes Tombstoning? |
63 |
7.3 What are the Tombstoning Rates? |
64 |
7.4 What can be done to Minimize Tombstoning? |
66 |
7.5 What about Mixed Alloys? |
67 |
7.6 What is Voiding? |
69 |
7.7 How do the Alloys Compare for Voiding? |
70 |
7.8 How can you prevent Voiding in Reflow? |
71 |
7.9 What causes Voids in Vias? |
72 |
7.10 What are the Inspection Issues? |
74 |
| Chapter 8 | 77 |
| Implementation | |
8.1 What is the European Lead Free survey? |
78 |
8.2 What about the ELFNET Survey? |
78 |
8.3 What is the Current status of EU Pb-Free? |
80 |
8.4 Where is a Pb-Free Readiness Assessment Tool? |
81 |
8.5 What is the Pb-free RAT? |
81 |
8.6 WEEE/RoHS Experts are valuable |
84 |
8.7 What to Think about for your BOM? |
84 |
8.8 How do you Work with your suppliers? |
85 |
8.9 How to go about Choosing a new Paste? |
85 |
8.10 What percent are RoHS compliant suppliers? |
87 |
8.11 What are Homogenous Materials? |
89 |
8.12 How do you do Planning for Review? |
90 |
| Chapter 9 | 93 |
| Pb-Free Printing and Placement | |
9.1 What is the Approximate Distribution of Process Related Defects? |
94 |
9.2 How Many Factors Affect your Print Quality? |
94 |
9.3 What is Motorola's Process Criteria? |
94 |
9.4 How do you do a Paste Evaluation and Selection Strategy? |
95 |
9.5 What items are Related to your Paste Selection? |
96 |
9.6 What are Paste Responses? |
96 |
9.7 What is the Paste Evaluation? |
96 |
9.8 What's the 12 Board Paste Evaluator? |
97 |
9.9 What are the Effects of Viscosity? |
97 |
9.10 What are the effects of Viscosity and Temperature? |
98 |
9.11 What is the Motorola Flux Tackiness Measurement? |
99 |
9.12 What is the effect on Solder Paste Stencil Life? |
99 |
9.13 What are the Effects of Short Stencil Life? |
99 |
9.14 What was the objective of the Motorola Stencil Printing Evaluation? |
100 |
9.15 What was the results of Response to Pause Test? |
100 |
9.16 What are the Effects of Poor Response to Pause? |
101 |
9.17 How do you go about Measuring Shear Thinning Effect? |
101 |
9.18 What is the Solder Paste resistance to Shear Thinning? |
102 |
9.19 Why worry about Solder Balls in Passive Assembly? |
102 |
9.20 What are Poor Gasketing results? |
103 |
9.21 Why the Importance of Wall/Pad Ratio? |
103 |
9.22 What changes for Stencil Design? |
103 |
| Chapter 10 | 105 |
| Pb-Free Reflow | |
10.1 What is the Approximate Distribution of Process Related Defects? |
106 |
10.2 What is crucial for Pb-free Reflow? |
106 |
10.3 What are the (Old) RDRP Profiles? |
107 |
10.4 What changes for the (New) Convection Ovens? |
108 |
10.5 What is unique about the (Old) IR Oven Profile Design? |
108 |
10.6 What is different about the (New) Convection Oven Profile Design? |
109 |
10.7 What are the unique Profiles and Defect Mechanisms? |
109 |
10.8 Explain Defect Mechanism Analysis 1 |
109 |
10.9 Explain Defect Mechanism Analysis 2 |
110 |
10.10 Explain Defect Mechanism Analysis 3 |
110 |
10.11 Explaining Defect Mechanism Analysis 4 |
111 |
10.12 Explaining Defect Mechanism Analysis 5 |
111 |
10.13 Explaining Defect Mechanism Analysis 6 |
111 |
10.14 Explaining Defect Mechanism Analysis 7 |
112 |
10.15 Explaining Defect Mechanism Analysis 8 |
112 |
10.16 Reflow Profile Summary |
113 |
10.17 Recap of the Motorola Reflow Profile Evaluation |
113 |
10.18 What was the Coalescence? |
114 |
10.19 Compare Reflow Profile and Coalescence |
115 |
10.20 How about the Wetting? |
115 |
10.21 State Motorola's Conclusion |
116 |
| Chapter 11 | 117 |
| Pb-Free Reliability Issues | |
11.1 Understand the Reliability of Pb-free |
118 |
11.2 What was the Motorola Reliability Evaluation? |
118 |
11.3 What was the Motorola Test Vehicle? |
118 |
11.4 What was the Motorola Drop Evaluation? |
119 |
11.5 What was the Motorola Thermal Shock Evaluation? |
119 |
| Chapter 12 | 121 |
| Pb-Free Wave Soldering & Alternative Soldering Methods | |
12.1 Which components get Wave Soldering? |
122 |
12.2 List some Pb-free Wave Challenges |
123 |
12.3 What is Tin Pest? |
123 |
12.4 When does Tin Corrosion occur? |
124 |
12.5 What are the industry Pb-free Wave Recommendations? |
124 |
12.6 What is crucial about Fluxing? |
125 |
12.7 List the Pb-free Wave Setup Rules of Thumb |
125 |
12.8 How do you Calculate Dwell Time? |
126 |
12.9 What is the Pin-in-Paste (PIP) Process? |
126 |
12.10 What are the PIP Concerns? |
126 |
12.11 How do you do the PIP Stencil Design? |
127 |
12.12 What are PIP Stencil Design Steps 1 & 2? |
127 |
12.13 What is PIP Stencil Design Step 3? |
128 |
12.14 What is PIP Stencil Design Step 4? |
128 |
12.15 Show some Common PIP Stencil Designs |
129 |
12.16 Show a Poor PIP Stencil Design |
129 |
12.17 What are Solder Preforms? |
129 |
12.18 What are some PIP Considerations? |
130 |
12.19 What to consider in PIP Solder Paste Selection? |
130 |
12.20 What is an option for PIP Stencil Printing? |
131 |
12.21 What about PIP Component Selection? |
131 |
12.22 State the Pb-free Wave & Alternative Soldering Methods Summary |
132 |
| Index | 133 |