SMT
Table of Contents

Table of Contents

1- CONCURRENT ENGINEERING

  • Why communication is essential

  • Why support is critical

  • Concurrent Engineering

  • Testing Objectives

  • Vital cultural philosophy to make testability work in the company

  • Who should head a design-build team?

  • Logistics

  • Efficient use of department resources

  • Use experts in the design teams

  • Getting product to market

  • Design for manufacturing

2- TESTABILITY CONSIDERATIONS
  • Test levels are significant cost factors

  • Other benefits

  • Is testability applicable to your system?

  • Responding to arguments why design personnel cannot add testability

  • A company should care about testability

  • Manufacturing is major source of problems

  • Ways to minimize the cost to develop and produce a product

  • DFT program implementation

  • DFT requires total commitment

  • Faults must be isolated

  • Evaluate feasibility and effectiveness of testing

  • Fixing the manufacturing line and rapid prototypes

  • Requirements, resources, and procedures

  • Requirements

  • Competitiveness

  • Causes of operational failures

  • Anomalies and their causes

  • Check list for manufacturing test engineering (MTE) conditions

  • Partition the boards

3- INTEGRATING CAD AND TESTERS
  • Saving the software generation

  • Integration of design and the factory

  • Bareboard test automation

  • Motherboard and cable testing automation

  • Full ICT abilities

  • Robotoic testing

  • Functional test automation

4- TESTABILITY GUIDELINES
  • Guide scenario

  • LRU guides

  • Board level guide

  • Placement of test points

  • Circuit VLSI/LSI guides

  • Mechanical guides

  • Analog guides

5- TEST METHODS
  • Types of testing and advantages and disadvantages

  • Component testing methods

  • Circuit board test methods

  • Kinds of faults at bareboard level

  • Testing bareboard using bed of nails (BON)

  • Non-contact or single-contact bareboard testing

  • Flying Probe

  • Flying Probe

  • Flying Probe C measurement method

  • Testing bareboard with ATE and BONs

  • Bareboard test types

  • Leakage

  • Dendrite

  • Additional topics not listed here

6- TESTING SURFACE MOUNT TECHNOLOGY
  • Testing SMT - problems and solutions

  • The trend to SMT and testing issues

  • Circuitry

  • Fixturing concerns

  • Doing it right at CAE and CAD

  • Staggering for simplicity

  • Standard cells

  • Pads and accuracies

  • Cad requirements for better BONs test

  • Safety in-clock interruption

  • Override of UUT with external control

  • Isolate, divide and conquer

  • Additional topics not listed here

7- SCAN
    Definition of SCAN
  • SCAN design advantages and disadvantages

  • The SCAN concept

  • SCAN F-F definition

  • Types of SCAN

  • Serial SCAN

  • Level sensitive SCAN

  • SCAN set

  • The combinations of boundary and serial SCAN

  • Serial SCAN test sequence

  • Random multiplexer SCAN

  • Random access SCAN

  • Additional topics not listed here

8- TEST STRATEGY
  • Strategy consideration

  • What is your company's culture?

  • Obtaining data

  • High volume strategy

  • Low volume strategy

  • Commercial/military - tey are not created equal

  • Economic aspects

  • Test strategy scenario

  • Field rejects, spares, and ESS

  • Rapid prototypes


SMT