Table of Contents

Chapter 1
Early Land Pattern Development

Chapter 2
Requirements of Land Patterns

Chapter 3
Component Standards

Chapter 4
Lead Free Solder Paste Impact on Patterns

Chapter 5
Stencil Apertures

Chapter 6
Solder Mask Opening Requirements

Chapter 7
Silk Screen

Chapter 8
Via in Land Use

Chapter 9
IPC-A-782 Standard

Chapter 10
Workmanship Standard IPC-A-610

Chapter 11
Chip Component Land Patterns

Chapter 12
SO, SON, QFP, L/TQFP Gull Wing Lead Component Land Patterns

Chapter 13
SOT Component Land Patterns

Chapter 14
DPAK/DDPAK Transistor Land Patterns

Chapter 15
Leadless Ceramic Component Land Patterns

Chapter 16
LPN, LPP & MLF Land Patterns

Chapter 17
BGA Component Land Patterns

Chapter 18
Wafer Bump, Flip Chip & CSP Land Patterns

Chapter 19
Electrolytic Component Land Patterns

Chapter 20
Tantalum Component Land Patterns

Chapter 21
MELF Component Land Patterns

Chapter 22
J-lead Component Land Patterns

Chapter 23
RF Active Component Land Patterns

Chapter 24
RF Filter Component Land Patterns

Chapter 25
Resistor Network Component Land Patterns

Chapter 26
Trimmer Component Land Patterns

Chapter 27
Connector Component Land Patterns

Chapter 28
Crystal & Oscillator Component Land Patterns

Chapter 29
LED Component Land Patterns

Chapter 30
Sockets

Chapter 31
Adhesives

Chapter 32
Wave Soldering

Chapter 33
Next Generation Patterns

Chapter 33
UltraLibrarian

Index