Troubleshooting SMT Processes and DFM

SMT is becoming the dominant technology for the designing of modern day electronic products. With smaller packages, automated assembly, lower parasitics and improvement in electrical performance, many of today's products could not be produced without the use of SMT. Introducing SMT can be accomplished easily by learning where the pitfalls and issues are before you begin designing, therefore avoiding the costly redesigns and escalated production costs to fix avoidable defects.

This one-day course is invaluable to those before or after entering SMT. It will save countless hours by providing an understanding of what is critical and what the proper steps are to controlling and maintain the process for successful production.

Who Would Benefit
This course has proven to be of immense value to manufacturing engineers, process technicians, project engineers, purchasing, quality and anyone involved in testing or troubleshooting.

Course Outline

SMT Components
There are many different packages used in SMT including BGAs. How these impact processes are discussed in this section. Topics include:

• SMT Leaded and Leadless Packages
  
• BGAA
  
• Fine Pitch and Ultra-Fine Pitch
  
• Planarity
  
• Solderability
  
• Handling and Purchasing Considerations
  
• Printed Circuit Boards

The impact of receiving quality printed circuit boards can not be unstated. There are many issues discussed about printed circuit boards including:

• Solderability
  
• Planarity Issues
  
• Solder Mask
  
• Silkscreens
  
• Vias
  
• Standards
  
• Procurement Requirements
  
• Surface Mount Assembly Process Flows

There are many different possible combinations of using SMT and through-hole parts, not all are cost effective. All the process flows are reviewed in this section including Type I, Type II, and Type III.

Manufacturing Processes
The successful design is a design that goes through manufacturing with the least amount of problems and defects. In this section, information helps to learn what is required to match up designs with processes. Topic include:

• Printing Solder Paste
  
• Handling and Storage of Solder Paste
  
• Stencil Design and Fabrication Options
  
• Printing Equipment
  
• Component Placement
  
• Reflow Types and Considerations
  
• Clean-up Options
  
• Yield Losses
  
• Qualifying Process Techniques
  
• Inspection and Test

The inspection and testing of product is key to determining what is acceptable. In this section, what needs to be inspected and how is presented as well as information on the types of testing available. Inspection needs include pre-soldering for boards, components, and solder paste. Post soldering inspection covers solder joints, using assorted equipment including manually and by x-ray or optical inspection systems.

Guidelines for Workmanship Standards
Knowing whether something is good or not is key. Too often product is over-inspected or not properly inspected. Topics include:

• Understanding the needs for standards as well as identifying failure modes
  
• Measurement accuracy
  
• Thermal processing history and standards applications for solder paste printing
  
• Adhesive dispensing
  
• Component placement
  
• Post solder inspection
  
• BGA
  
• Troubleshooting Methods

Troubleshooting and maintaining a process are key to successful production. Covered topics include:

• Troubleshooting Methods
  
• Necessity
  
• Statistical Methods including:
  
• Control Charts
  
• Variable Data
  
• Attributes Data
  
• How to Analyze for Corrective Actions
  
• SPC Points for SMT
  
• Implementation of SPC

Course Materials: Troubleshooting the SMT/FPT Process
Instructor: James C. Blankenhorn